The Importance of Temporal and Spatial Temperature Gradients in IC Reliability Analysis

Existing IC reliability models assume a uniform, typically worst-case, operating temperature, but temporal and spatial tem- perature variations affect expected device lifetime. This paper presents a model that accounts for temperature gradients, dra- matically improving interconnect and gate-oxide lifetime pre- diction accuracy. By modeling expected lifetime as a resource that is consumed over time at a temperature-dependent rate, sub- stantial design margin can be reclaimed and/or less expensive cooling systems may be used. This report is superseded by TR CS-2004-08.

Huang, Wei, Zhijian Lu, Shougata Ghosh, John Lach, Mircea Stan, and Kevin Skadron. "The Importance of Temporal and Spatial Temperature Gradients in IC Reliability Analysis." University of Virginia Dept. of Computer Science Tech Report (2004).