Interconnect Lifetime Prediction for Temperature-Aware Design

Thermal effects are becoming a limiting factor in high-performance circuit design due to the strong temperature-dependence of leakage power, circuit performance, IC package cost and reliability. Temperature-aware design tries to maximize performance under a given thermal envelope through various static and dynamic approaches. While existing interconnect reliability models assume a constant temperature, this paper presents a technique for probabilistically estimating interconnect lifetime for any time-varying temperature profile. With this formulation, interconnect lifetime can be modeled as a resource that is consumed over time, with the rate of consumption being a function of temperature. As a result, designers may be more aggressive in the temperature profiles that are allowed on a chip instead of using static worst-case assumptions. For example, performance (hence power and temperature) may be increased beyond what is allowed by worst-case restrictions for short periods as long as the increase is compensated for later by lower activity. With this model, temperature-aware designs will achieve higher overall performance while satisfying lifetime requirements.This report is superseded by TR CS-2004-08.
Note: Abstract extracted from PDF text

Lu, Zhijian, Mircea Stan, John Lach, and Kevin Skadron. "Interconnect Lifetime Prediction for Temperature-Aware Design." University of Virginia Dept. of Computer Science Tech Report (2003).