Monitoring Temperature in FPGA Based SoCs

Report
Authors:Velusamy, Siva, Department of Computer ScienceUniversity of Virginia Huang, Wei, Department of Computer ScienceUniversity of Virginia Lach, John, Department of Computer ScienceUniversity of Virginia Skadron, Kevin, Department of Computer ScienceUniversity of Virginia
Abstract:

FPGA logic densities continue to increase at a tremen- dous rate. This has had the undesired consequence of in- creased power density, which manifests itself as higher on- die temperatures and local hotspots. Sophisticated packag- ing techniques have become essential to maintain the health of the chip. In addition to static techniques to reduce the temperature, dynamic thermal management techniques are essential. Such techniques rely on accurate on-chip tem- perature information. In this paper, we present the design of a system that monitors the temperatures at various lo- cations on the FPGA. This system is composed of a con- troller interfacing to an array of temperature sensors that are implemented on the FPGA fabric. Such a system can be used to implement dynamic thermal management tech- niques. We cross validate the sensor readings with values obtained from HotSpot, a pre-RTL architectural level ther- mal modeling tool.

Rights:
All rights reserved (no additional license for public reuse)
Language:
English
Source Citation:

Velusamy, Siva, Wei Huang, John Lach, and Kevin Skadron. "Monitoring Temperature in FPGA Based SoCs." University of Virginia Dept. of Computer Science Tech Report (2004).

Publisher:
University of Virginia, Department of Computer Science
Published Date:
2004